Long-term testing of hermetic anodically bonded glass-silicon packages

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 423-426

  Harpster, Timothy J ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIOCOMPATIBILITY; ENCAPSULATION; GLASS; MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; TEMPERATURE;

GLASS SILICON PACKAGES; HERMITICALLY SEALED PACKAGES; HERMITICITY; PHOSPHATE BUFFERED SALINE;

ELECTRONICS PACKAGING;

EID: 0036124049     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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