Formation of silicon-gold eutectic bond using localized heating method

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 37, Issue 11 SUPPL. B, 1998, Pages

  Lin, Liwei ^a   Cheng, Yu Ting ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Eutectic bonding; Localized heating; Microfabrication; Microheater; Silicon gold system

Indexed keywords

BOND STRENGTH (MATERIALS); DIFFUSION; ELECTRIC HEATING; EUTECTICS; FRACTURE TOUGHNESS; GOLD; INTERFACES (MATERIALS); SILICON; SUBSTRATES;

EUTECTIC BONDING; LOCALIZED HEATING; MICROFABRICATION; MICROHEATERS;

BONDING;

EID: 0032205788     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.l1412     Document Type: Article

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