Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2001, Pages 18-21

  Cheng, Y T ^a   Hsu, W T ^a   Lin, L ^a   Nguyen, C T ^a   Najafi, K ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS BONDING; MICROELECTROMECHANICAL DEVICES; PRESSURE EFFECTS; RESONATORS; VACUUM APPLICATIONS;

VACUUM ENCAPSULATION;

ELECTRONICS PACKAGING;

EID: 0035017677     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)