Batch transfer of microstructures using flip-chip solder bonding

Journal of Microelectromechanical Systems

Volumn 8, Issue 1, 1999, Pages 27-32

  Singh, Angad ^a,b   Horsley, David A ^c   Cohn, Michael B ^b   Pisano, Albert P ^b   Howe, Roger T ^a,b  

^a IEEE   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

Flip chip; Microassembly; Microstructure transfer; Solder bonding

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROMACHINING; SHEAR STRESS; SOLDERING; TENSILE STRESS;

MICROSTRUCTURE TRANSFER; SACRIFICIAL-LAYER MICROMACHINING;

MICROELECTROMECHANICAL DEVICES;

EID: 0033100269     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.749399     Document Type: Article

References (13)

1. J. M. Bustillo, G. K. Fedder, C. T. C. Nguyen, and R. T. Howe, "Process technology for the modular integration of CMOS and polysilicon microstructures," Microsyst. Technol., vol. 1, pp. 30-41, Oct. 1994.
2. T. Core, R. S. Payne, D. Quinn, S. Sherman, and W. K. Wong, "Integrated, complete, affordable accelerometer for air-bag applications," in Proc. Sensors Expo, Chicago, IL, 1991, pp. 39-47.
3. L. S. Goodman, "Geometric optimization of controlled collapse interconnections," IBM J. Res. Develop., vol. 13, no. 3, pp. 251-265, 1969.
4. K. W. Marcus, V. Dhuler, D. Roberson, A. Cowen, M. Berry, and S. Nangalia, "Smart MEMS: Flip chip integration of MEMS and electronics," presented at SPIE Smart Materials Conf., Feb. 1995.
5. M. B. Cohn, R. T. Howe, and A. P. Pisano, "Wafer-wafer transfer of microstructures for vacuum packaging," presented at Solid State Sensors and Actuators Workshop, Hilton Head, SC, June 1994.
6. K. W. Goossen, J. A. Walker et al., "GaAs MQW modulators integrated with silicon CMOS," IEEE Photon. Technol. Lett., vol. 7, p. 4, Apr. 1995.
7. E. T. Yablonovitch, J. P. Harbison, and R. Bhat, "Extreme selectivity in the lift-off of epitaxial GaAs films," Appl. Phys. Lett., vol. 51, pp. 2222-2224, Dec. 28, 1987.
8. D. A. Horsley, A. Singh, A. P. Pisano, and R. Horowitz, "Angular micropositioners for disk drives," in Int. Workshop on Micro Electro Mechanical Systems, Nagoya, Japan, 1997, pp. 454-459.
9. D. A. Horsley, M. B. Cohn, A. Singh, A. P. Pisano, and R. Horowitz, "Design and fabrication of an angular microactuator for magnetic disk drives," IEEE J. Microelectromech. Syst., vol. 7, pp. 141-148, June 1998.
10. C. G. Keller and M. Ferrari, "Milli-scale polysilicon structures," in Solid-State Sensor and Actuator Workshop, Hilton Head, SC, June 1994, pp. 132-137.
11. K.-D. Muller, W. Bacher, and M. Heckele, "Flexible integration of nonsilicon microstructures on microelectronic circuits," in Int. Workshop on Micro Electro Mechanical Systems, Heidelberg, Germany, 1998, pp. 263-267.
12. J. M. Gere and S. P. Timoshenko, Mechanics of Materials, 3rd ed. PWS-Kent, 1990.
13. B. Shivkumar and C.-J. Kim, "Microriveting - A new wafer joining method," in Int. Workshop on Micro Electro Mechanical Systems, Nagoya, Japan, 1997, pp. 497-202.