Microsensor packaging

Microsystem Technologies

Volumn 7, Issue 5-6, 2002, Pages 205-208

  Brand, O ^a   Baltes, H ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIES; ELECTRONICS PACKAGING; IMAGE SENSORS; INFRARED IMAGING; INTEGRATING CIRCUITS; SURFACE MOUNT TECHNOLOGY;

CURRENT PACKAGING; MICROSYSTEMS; PLASTIC BALL GRID ARRAY (BGA); THERMAL IMAGER;

MICROSENSORS;

EID: 22344442305     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420100110     Document Type: Conference Paper

References (19)

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