A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators

Journal of Microelectromechanical Systems

Volumn 5, Issue 3, 1996, Pages 166-179

  Ziaie, Babak ^b,c,d,e,f   Von Arx, Jeffrey A ^b,d,f,g   Dokmeci, Mehmet R ^b,d,h   Najafi, Khalil ^a,b,d,g,i  

^a IEEE

^b University of Michigan   (United States)

^c UNIVERSITY OF TEHRAN   (Iran)

^d UNIVERSITY OF MICHIGAN   (United States)

^e UNIVERSITY OF ALABAMA SCHOOL OF MEDICINE   (United States)

^f Tau Beta Pi ^*

^g TUFTS UNIVERSITY   (United States)

^h UNIVERSITY OF MINNESOTA   (United States)

ⁱ Elec Eng and Comp Sci Department

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; BONDING; CAPACITORS; ELECTRONIC PROPERTIES; GLASS; LOW TEMPERATURE OPERATIONS; RELIABILITY; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS;

ARRHENIUS DIFFUSION MODEL; ELECTROSTATIC BONDING; HERMETIC GLASS SILICON MICROPACKAGE; HIGH DENSITY ON CHIP FEEDTHROUGHS; MEAN TIME TO FAILURE; MOISTURE PENETRATION; PACKAGE HERMICITY; PHOSPHOSILICATE GLASS;

MICROELECTRONIC PROCESSING;

EID: 0030246136     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.536623     Document Type: Article

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