Batch transfer of LIGA microstructures by selective electroplating and bonding

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 259-264

  Pan, Li Wei ^a   Lin, Liwei ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CURRENT DENSITY; ELECTRONICS PACKAGING; ELECTROPLATING; FLIP CHIP DEVICES; HEATING; MICROSTRUCTURE; NICKEL PLATING; THERMAL EXPANSION;

BATCH TRANSFER PROCESS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033719378     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)