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Volumn 45, Issue 6, 1998, Pages 877-885

Reliability test methods for mediAcompatible pressure sensors

Author keywords

Corrosion; Corrosion testing; Encapsulation; Microsensors; Packaging; Piezoresistive devices; Protective coatings; Reliability; Reliability modeling; Silicones; Weibull distributions

Indexed keywords

CORROSION; MATERIALS TESTING; MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; PIEZOELECTRIC DEVICES; PROTECTIVE COATINGS; RELIABILITY; WEIBULL DISTRIBUTION;

EID: 0032293733     PISSN: 02780046     EISSN: None     Source Type: Journal    
DOI: 10.1109/41.735331     Document Type: Article
Times cited : (11)

References (47)
  • 1
    • 84914208652 scopus 로고    scopus 로고
    • Lack of manufacturing know-how is slowing the MEMS revolution, vol. 38, no. 10, pp. 50-52, Oct. 1995.
    • F. Maseeh, "Lack of manufacturing know-how is slowing the MEMS revolution," Solid State Technol, vol. 38, no. 10, pp. 50-52, Oct. 1995.
    • Solid State Technol
    • Maseeh, F.1
  • 2
    • 33747347861 scopus 로고    scopus 로고
    • The sensor-based MEMS market: An underachiever?, vol. 2, no. 18, Aug. 30, 1995.
    • "The sensor-based MEMS market: An underachiever?," Sens. Bus. News, vol. 2, no. 18, Aug. 30, 1995.
    • Sens. Bus. News
  • 6
    • 33747364237 scopus 로고    scopus 로고
    • Physics-of-failure-based reliability qualification of automotive electronics, vol. 1, no. 2, pp. 21-33, 1994.
    • J. M. Hu, "Physics-of-failure-based reliability qualification of automotive electronics," Commun. RMS, vol. 1, no. 2, pp. 21-33, 1994.
    • Commun. RMS
    • Hu, J.M.1
  • 7
    • 33747348140 scopus 로고    scopus 로고
    • Semiconductor sensor performance and reliability for the appliance industry, presented at the Int. Appliance Tech. Conf., Champaign/Urbana, IL, 1995.
    • T. Maudie and J. Wertz, "Semiconductor sensor performance and reliability for the appliance industry," presented at the Int. Appliance Tech. Conf., Champaign/Urbana, IL, 1995.
    • Maudie, T.1    Wertz, J.2
  • 8
    • 33747351083 scopus 로고    scopus 로고
    • Improving reliability of electronic appliance pressure sensors, 39, Apr. 1995.
    • T. Maudie, "Improving reliability of electronic appliance pressure sensors," Appliance, p. 39, Apr. 1995.
    • Appliance, P.
    • Maudie, T.1
  • 10
    • 33747359423 scopus 로고    scopus 로고
    • Media compatible pressure tranducer, U.S. Patent 4222277, Sept. 16, 1980.
    • A. D. Kurtz and J. R. Mallon, "Media compatible pressure tranducer," U.S. Patent 4222277, Sept. 16, 1980.
    • Kurtz, A.D.1    Mallon, J.R.2
  • 11
    • 0029225104 scopus 로고    scopus 로고
    • A CMOS-compatible, surface micromachined pressure sensor for aqueous ultrasonic applications, in 95, Austin, TX, 1995, pp. 258-265.
    • W. P. Eaton and J. H. Smith, "A CMOS-compatible, surface micromachined pressure sensor for aqueous ultrasonic applications," in Proc. Micromachining and Microfabrication '95, Austin, TX, 1995, pp. 258-265.
    • Proc. Micromachining and Microfabrication '
    • Eaton, W.P.1    Smith, J.H.2
  • 12
    • 0026225616 scopus 로고    scopus 로고
    • Silicon-to-silicon anodic bonding with a borosilicate glass layer, vol. 1, pp. 139-144, 1991.
    • A. Hanneborg, M. Nese, and P. 0hlckers, "Silicon-to-silicon anodic bonding with a borosilicate glass layer," J. Micromech. Microeng., vol. 1, pp. 139-144, 1991.
    • J. Micromech. Microeng.
    • Hanneborg, A.1    Nese, M.2    Ohlckers, P.3
  • 14
    • 0027611874 scopus 로고    scopus 로고
    • Anodic bonding of silicon to silicon wafers coated with aluminum, silicon oxide, polysilicon or silicon nitride, vol. 37-38, pp. 61-67, 1993.
    • M. Nese and A. Hanneborg, "Anodic bonding of silicon to silicon wafers coated with aluminum, silicon oxide, polysilicon or silicon nitride," Sens. Actuators A, vol. 37-38, pp. 61-67, 1993.
    • Sens. Actuators a
    • Nese, M.1    Hanneborg, A.2
  • 15
    • 0022790455 scopus 로고    scopus 로고
    • Environmental concerns for integrated circuit sensors, vol. 19, pp. 210-213, 1986.
    • M. Noble, "Environmental concerns for integrated circuit sensors," Meas. Contr., vol. 19, pp. 210-213, 1986.
    • Meas. Contr.
    • Noble, M.1
  • 16
    • 33747366416 scopus 로고    scopus 로고
    • Flexible miniature packaging from Lucas NovaSensor provides low-cost pressure sensor solutions to a wide variety of hostile media applications, 118-120, Apr. 13, 1995.
    • K. Ryan, J. Bryzek, and R. Grace, "Flexible miniature packaging from Lucas NovaSensor provides low-cost pressure sensor solutions to a wide variety of hostile media applications," ECN, pp. 118-120, Apr. 13, 1995.
    • ECN, Pp.
    • Ryan, K.1    Bryzek, J.2    Grace, R.3
  • 18
    • 0030091517 scopus 로고    scopus 로고
    • Packaging of physical sensors for aggressive media applications, vol. 6, pp. 187-192, 1996.
    • K. Dyrbye, T. Romedahl Brown, and G. Friis Eriksen, "Packaging of physical sensors for aggressive media applications," J. Micromech. Microeng., vol. 6, pp. 187-192, 1996.
    • J. Micromech. Microeng.
    • Dyrbye, K.1    Romedahl Brown, T.2    Friis Eriksen, G.3
  • 19
    • 0030092252 scopus 로고    scopus 로고
    • A new piezoresistive pressure transducer principle with improvements in media compatibility, vol. 6, pp. 105-107, 1996.
    • O. S0ndergard and P. Gravesen, "A new piezoresistive pressure transducer principle with improvements in media compatibility," J. Micromech. Microeng., vol. 6, pp. 105-107, 1996.
    • J. Micromech. Microeng.
    • Sondergard, O.1    Gravesen, P.2
  • 21
    • 0029369502 scopus 로고    scopus 로고
    • Influences of humidity and moisture on the long-term stability of piezoresistive pressure sensors, vol. 16, pp. 21-29, 1995.
    • A. Nakladal, K. Sager, and G. Gerlach, "Influences of humidity and moisture on the long-term stability of piezoresistive pressure sensors," Measurement, vol. 16, pp. 21-29, 1995.
    • Measurement
    • Nakladal, A.1    Sager, K.2    Gerlach, G.3
  • 22
    • 0020127035 scopus 로고    scopus 로고
    • Silicon as a mechanical material, vol. 70, pp. 420-57, May 1982.
    • K. E. Petersen, "Silicon as a mechanical material," Proc. IEEE, vol. 70, pp. 420-57, May 1982.
    • Proc. IEEE
    • Petersen, K.E.1
  • 24
    • 33747343736 scopus 로고    scopus 로고
    • Semiconductor pressure sensor, Kokai Patent Hei 5-223670, Aug. 31, 1993.
    • T. Ito, "Semiconductor pressure sensor," Kokai Patent Hei 5-223670, Aug. 31, 1993.
    • Ito, T.1
  • 27
    • 0029190459 scopus 로고    scopus 로고
    • Thin film polymer stress measurement using piezoresistive anisotropically etched pressure sensors, in 1995, pp. 103-109.
    • D. J. Monk and M. Shah, "Thin film polymer stress measurement using piezoresistive anisotropically etched pressure sensors," in Proc. Materials Research Soc. Symp., San Francisco, CA, 1995, pp. 103-109.
    • Proc. Materials Research Soc. Symp., San Francisco, CA
    • Monk, D.J.1    Shah, M.2
  • 28
    • 20544435274 scopus 로고    scopus 로고
    • Oxidative degradation of parylene C (poly (monochloro-parAxylylene)) thin films on bulk micromachined piezoresistive silicon pressure sensors, vol. 9, no. 5, pp. 307-319, 1997.
    • D. J. Monk, H. S. Toh, and J. Wertz, "Oxidative degradation of parylene C (poly (monochloro-parAxylylene)) thin films on bulk micromachined piezoresistive silicon pressure sensors," Sens. Mater., vol. 9, no. 5, pp. 307-319, 1997.
    • Sens. Mater.
    • Monk, D.J.1    Toh, H.S.2    Wertz, J.3
  • 30
    • 0022947698 scopus 로고    scopus 로고
    • Measuring the stress component of conformai coatings on surface mount devices, in 19, pp. 236-247.
    • R. Olson, "Measuring the stress component of conformai coatings on surface mount devices," in Proc. Int. Symp. Microelectronics, 19, pp. 236-247.
    • Proc. Int. Symp. Microelectronics
    • Olson, R.1
  • 31
    • 0028670785 scopus 로고    scopus 로고
    • The challenges for hermetic encapsulation of implanted devices-A review, vol. 22, no. 1, pp. 39-67, 1994.
    • M. F. Nichols, "The challenges for hermetic encapsulation of implanted devices-A review," Crit. Rev. Biomed. Eng., vol. 22, no. 1, pp. 39-67, 1994.
    • Crit. Rev. Biomed. Eng.
    • Nichols, M.F.1
  • 32
    • 0030092321 scopus 로고    scopus 로고
    • Protective coatings in harsh environments, vol. 6, pp. 55-57, 1996.
    • G. F. Eriksen and K. Dyrbye, "Protective coatings in harsh environments," J. Micromech. Microeng., vol. 6, pp. 55-57, 1996.
    • J. Micromech. Microeng.
    • Eriksen, G.F.1    Dyrbye, K.2
  • 35
    • 0027044266 scopus 로고    scopus 로고
    • Recent advances in the application of high performance siloxanes polymers in electronic packaging, in
    • C. P. Wong, "Recent advances in the application of high performance siloxanes polymers in electronic packaging," in Proc. 6th Int. SAMPE Electronics Conf., 19, pp. 508-520.
    • Proc. 6th Int. SAMPE Electronics Conf., 19, Pp. 508-520.
    • Wong, C.P.1
  • 36
    • 0004234411 scopus 로고    scopus 로고
    • Parylene coatings, in Volume 1: Packaging, M. L. Minges, C. A. Dostal, and M. S. Woods, Eds. Materials Park, OH: ASM International, 1989, pp. 789-801.
    • W. F. Beach, T. M. Austin, and R. Olson, "Parylene coatings," in Electronic Materials Handbook, Volume 1: Packaging, M. L. Minges, C. A. Dostal, and M. S. Woods, Eds. Materials Park, OH: ASM International, 1989, pp. 789-801.
    • Electronic Materials Handbook
    • Beach, W.F.1    Austin, T.M.2    Olson, R.3
  • 38
    • 84943713514 scopus 로고    scopus 로고
    • A new, general synthetic method for the preparation of linear poly-p-xylylenes, vol. 4, pp. 3027-3039, 1966.
    • W. F. Gorham, "A new, general synthetic method for the preparation of linear poly-p-xylylenes," J. Polym. Sei, vol. 4, pp. 3027-3039, 1966.
    • J. Polym. Sei
    • Gorham, W.F.1
  • 46
    • 0029425221 scopus 로고    scopus 로고
    • Pressure leakage through material interfaces in pressure sensor packages, in 1995, pp. 87-93.
    • D. J. Monk, "Pressure leakage through material interfaces in pressure sensor packages," in Proc. Sensors in Electronic Packaging, San Francisco, CA, 1995, pp. 87-93.
    • Proc. Sensors in Electronic Packaging, San Francisco, CA
    • Monk, D.J.1
  • 47
    • 1642376259 scopus 로고    scopus 로고
    • Solubility parameter values, in 3rd ed., J. Brandrup and E. H. Immergut, Eds. New York: Wiley, 1989, pp. VII/519-557.
    • E. A. Grulke, "Solubility parameter values," in Polymer Handbook, 3rd ed., J. Brandrup and E. H. Immergut, Eds. New York: Wiley, 1989, pp. VII/519-557.
    • Polymer Handbook
    • Grulke, E.A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.