Field-assisted bonding of glass to Si-Au eutectic solder for packaging applications

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 630-633

  Harpster, Timothy J ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; EUTECTICS; GLASS; GOLD; SILICON WAFERS;

ANODIC BONDING; EUTECTIC SOLDER; PYREX GLASS; SILICON-GOLD EUTECTIC MIXTURE; WAFER BONDING;

SOLDERED JOINTS;

EID: 0037817758     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. K. Najafi, "Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS," Proceedings, SPIE's Micromachining and Microfabrication Symposium, San Jose, CA, USA, January 25-31, 2003.
2. D. Sparks, et. al., "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder", J. of Micromechanics and Microengineering, vol. 11, no. 6 Nov. 2001, pp. 630-634.
3. M. Dunn, et. al., "Initiation toughness of silicon/glass anodic bonds", Acta Materialia, vol. 48, no. 3, Feb. 2000, pp. 735-744.
4. H. H. Manko, Solders and Soldering. The metallurgy of solder, 4th ed. New York, McGraw-Hill. 2001, pp. 73-81.
5. R. F. Wolffenbuttel, "Low-temperature intermediate Au-Si wafer bonding: eutectic or silicide bond", Sensors and Actuators, vol. A62, no. 1-3, July 1997, p.680-6.
6. T. Lee, et. al., "An improved anodic bonding process using pulsed voltage technique", JMEMS, vol.9, no.4, Dec. 2000, p.469-73.
7. A. Katz, et. al., "In situ stress measurements of gold films on glass substrates during thermal cycling", J. Appl. Phys., vol. 70, no. 12, Dec. 1991, pp. 7342-7348.
8. M. R. Dokmeci, "Hermetic glass-silicon micropackages and feedthroughs for neural prostheses", Doctoral thesis, University of Michigan, 2000, pp. 42.