Reliability of industrial packaging for microsystems

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 1251-1260

  De Reus, R ^a   Christensen, C ^a   Weichel, S ^a   Bouwstra, S ^a   Janting, J ^b   Friis Eriksen, G ^b   Dyrbye, K ^b   Romedahl Brown, T ^b   Krog, J P ^c   Sondergard Jensen O ^c   Gravesen, P ^c  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b Grundfos DK AS   (Denmark)

^c DANFOSS A S   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; BOND STRENGTH (MATERIALS); ELECTRONICS PACKAGING; ETCHING; MICROELECTRONICS; MICROPROCESSOR CHIPS; PHOTORESISTS; PROTECTIVE COATINGS; RELIABILITY; SILICON CARBIDE; SILICON WAFERS; THIN FILMS;

SILICON-BASED MICROMACHINED SENSORS; THROUGH-HOLE ELECTRICAL FEEDTHROUGHS;

SILICON SENSORS;

EID: 0032083807     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(98)00149-8     Document Type: Article

References (22)

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