Batch wafer scale LIGA assembly and packaging technique via diffusion bonding

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1999, Pages 476-481

  Christenson, Todd R ^a   Schmale, Dave T ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); DIFFUSION IN SOLIDS; TORSIONAL STRESS;

DIFFUSION BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 0032627378     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)