Local laser bonding for low temperature budget

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 422-427

  Mescheder, U M ^a   Alavi, M ^b   Hiltmann, K ^b   Lietzau, Ch ^b   Nachtigall, Ch ^a   Sandmaier, H ^c  

^a FURTWANGEN UNIVERSITY   (Germany)

^b Institute of Micromachining and Information Technology   (Germany)

^c UNIVERSITY OF STUTTGART   (Germany)

Author keywords

Eutectic bonding; Laser micromachining; Wafer bonding

Indexed keywords

ALUMINUM ALLOYS; BOND STRENGTH (MATERIALS); BONDING; ELECTRIC CONTACTS; EUTECTICS; LASER BEAM EFFECTS; LOW TEMPERATURE EFFECTS; MICROMACHINING; SILICON WAFERS;

ANODIC BONDING; EUTECTIC ALLOY; EUTECTIC TEMPERATURE; LASER BONDING; PYREX;

MICROELECTROMECHANICAL DEVICES;

EID: 0036544168     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00871-8     Document Type: Conference Paper

References (6)

1. Anodic bonding
2. Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature
3. Assembling three-dimensional microstructures using gold-silicon eutectic bonding
4. Entwicklung eines laserunterstützten Bondprozesses für Anwendungen in der Mikromechanik