Solder self-assembly for three-dimensional microelectromechanical systems

Sensors and Actuators, A: Physical

Volumn 77, Issue 3, 1999, Pages 237-244

  Harsh, Kevin F ^a   Bright, Victor M ^a   Lee, Y C ^a  

^a NSF Ctr Adv Mfg Packaging M   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL ENERGY; MATHEMATICAL MODELS; MICROMACHINING; MOLTEN MATERIALS; SOLDERING; SURFACE TENSION; THREE DIMENSIONAL;

SELF ASSEMBLY ANGLE PRECISION; SELF LOCKING MECHANISM; SOLDER TECHNOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 0033331170     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00220-4     Document Type: Article

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