Laser welding: providing alignment precision and accuracy to substrate level packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3874, Issue , 1999, Pages 158-164

  Brown, Joe ^a   Maier, Nickolaus ^a   Lee, Kim Y ^a   Ziegltrum, Lorenz ^a   St Leger, Jim ^a  

^a Karl Suss America Waterbury Cent   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; PLASMA ETCHING; THREE DIMENSIONAL;

ALIGNMENT PRECISION; SUBSTRATE LEVEL PACKAGING;

LASER BEAM WELDING;

EID: 0033346526     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)