Microrivets for MEMS packaging: Concept, fabrication, and strength testing

Journal of Microelectromechanical Systems

Volumn 6, Issue 3, 1997, Pages 217-225

  Shivkumar, Bharat ^a,b,c,d,e   Kim, Chang Jin ^a,c  

^a IEEE   (United States)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d INDIAN INSTITUTE OF TECHNOLOGY MADRAS   (India)

^e National Center for Health Statistics   (United States)

Author keywords

Electroplating; Microrivet; Packaging; Strength testing; Wafer joining

Indexed keywords

BONDING; ELECTRIC FIELDS; ELECTRONICS PACKAGING; ELECTROPLATING; FABRICATION; JOINING; MECHANICAL TESTING; MECHANICAL VARIABLES MEASUREMENT; RIVETING;

MICRORIVETS; STRENGTH TESTING; WAFER BONDING PROCESSES;

MICROELECTROMECHANICAL DEVICES;

EID: 0031235920     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.623110     Document Type: Article

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