Batch transfer of microstructures using flip-chip solder bump bonding

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 1, Issue , 1997, Pages 265-268

  Singh, Angad ^a   Horsley, David A ^a   Cohn, Michael B ^a   Pisano, Albert P ^a   Howe, Roger T ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; FLIP CHIP DEVICES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SHEAR STRENGTH; SOLDERING; TENSILE STRENGTH;

FLIP CHIP SOLDER BUMP BONDING;

MICROELECTRONIC PROCESSING;

EID: 0030659231     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)