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Volumn , Issue , 2003, Pages 506-509

A doubly anchored surface micromachined pirani gauge for vacuum package characterization

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; COMPUTER SOFTWARE; DESIGN; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; MICROMACHINING; PRESSURE MEASUREMENT; SURFACES; VACUUM GAGES;

EID: 0038155575     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (59)

References (10)
  • 1
    • 0031650480 scopus 로고    scopus 로고
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    • C. T.-C. Nguyen, "Microelectromechanical devices for wireless communications," MEMS e98, Heidelberg, Germany, pp. 1-7, 1998.
    • (1998) MEMS e98, Heidelberg, Germany , pp. 1-7
    • Nguyen, C.T.-C.1
  • 2
    • 0035368205 scopus 로고    scopus 로고
    • A HARPSS polysilicon vibrating ring gyroscope
    • F. Ayazi, et al., "A HARPSS polysilicon vibrating ring gyroscope," JMEMS, vol. 10, pp. 169-179, 2001.
    • (2001) JMEMS , vol.10 , pp. 169-179
    • Ayazi, F.1
  • 3
    • 0035506511 scopus 로고    scopus 로고
    • Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder
    • D. Sparks et al., "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder," Journal of Microm. and Microe., vol. 11, pp. 630-634, 2001.
    • (2001) Journal of Microm. and Microe. , vol.11 , pp. 630-634
    • Sparks, D.1
  • 4
    • 0035017677 scopus 로고    scopus 로고
    • Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
    • Y. T. Cheng, et al., "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," MEMS ē01, Interlaken, Switzerland, pp. 2001.
    • MEMS ē01, Interlaken, Switzerland , pp. 2001
    • Cheng, Y.T.1
  • 5
    • 1842447961 scopus 로고
    • Miniaturized thin film thermal vacuum sensor
    • D. Jacobs, et al., "Miniaturized thin film thermal vacuum sensor," JVST A, vol. 13, pp. 2980-5, 1995.
    • (1995) JVST A , vol.13 , pp. 2980-2985
    • Jacobs, D.1
  • 7
    • 0009224857 scopus 로고
    • High performance pirani vacuum gauge
    • J.-S. Shie, et al., "High Performance Pirani Vacuum Gauge," JVST A, vol. 13, pp. 2972-2979, 1995.
    • (1995) JVST A , vol.13 , pp. 2972-2979
    • Shie, J.-S.1
  • 8
    • 0038465936 scopus 로고
    • Ph.D. Thesis, Thermal Applications of Microbridges, in Electrical Engineering and Computer Science at The University of California, Berkeley, CA
    • C. H. Mastrangelo, Ph.D. Thesis, Thermal Applications of Microbridges, in Electrical Engineering and Computer Science at The University of California, Berkeley, CA, 1991.
    • (1991)
    • Mastrangelo, C.H.1
  • 9
    • 0031070230 scopus 로고    scopus 로고
    • Deformation control of metal/nitride microbridges
    • M. Taguchi, et al., "Deformation Control of Metal/Nitride Microbridges," IEICE Transactions on Electronics, vol. E80-C, pp. 221-5, 1997.
    • (1997) IEICE Transactions on Electronics , vol.E80-C , pp. 221-225
    • Taguchi, M.1
  • 10
    • 78249284061 scopus 로고    scopus 로고
    • A wafer-level vacuum packaging technology utilizing electroplated nickel
    • B. H. Stark, et al., "A Wafer-Level Vacuum Packaging Technology Utilizing Electroplated Nickel," ASME IMECE, New Orleans, LA, 2002.
    • ASME IMECE, New Orleans, LA, 2002
    • Stark, B.H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.