Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2000, Pages 757-762

  Cheng, Y T ^a   Lin, Liwei ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; ELECTRIC CURRENTS; GLASS; HEATING EQUIPMENT; MICROELECTROMECHANICAL DEVICES; POLYCRYSTALLINE MATERIALS; SILICON;

ALUMINUM/SILICON-TO-GLASS BONDING; HERMETIC PACKAGES;

ELECTRONICS PACKAGING;

EID: 0033727437     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (18)