Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2004, Pages 27-32

  Stinson Bagby, Kelly ^a   Huff, Dan ^b   Katsis, Dimos ^b   Van Wyk, Daan ^b   Lu, G Q ^b  

^a LUNA INNOVATIONS INC   (United States)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Lead free; Microstruxtural analysis; Power cycling; Scanning acoustic microscopy (SAM); Scanning electron miroscopy (SEM); Thermal cycling

Indexed keywords

LEAD-FREE SOLDER DIES; MICROSTRUXTURAL ANALYSIS; POWER CYCLING; SCANNING ACOUSTIC MICROSCOPY (SAM);

DIES; ELASTIC MODULI; INTERFACES (COMPUTER); METALLOGRAPHY; MICROSTRUCTURE; MOSFET DEVICES; PROJECT MANAGEMENT; RELIABILITY; SOLDERING ALLOYS; THERMAL CYCLING; THERMAL EFFECTS; THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 4444315791     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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