Sinter materials for broad process windows in DCB packages - Concepts and results

2012 7th International Conference on Integrated Power Electronics Systems, CIPS 2012

Volumn , Issue , 2012, Pages

  Schmitt, Wolfgang ^a   Fritzsche, Sebastian ^a   Thomas, Muriel ^a  

^a Heraeus Materials Technology GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH POWER DENSITY; HIGH PRESSURE SINTERING; JOINING TECHNOLOGY; LOW AND MEDIUM POWER; PRESSURE AND TEMPERATURE; PROCESS CONSTRAINTS; PROCESS TECHNOLOGIES; SOLDER REPLACEMENT;

ADHESIVE JOINTS; ADHESIVE PASTES; ELECTRIC PROPERTIES; SILVER; SOLDERING ALLOYS;

SINTERING;

EID: 84881107734     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Sven Klaka: Eine Niedertemperatur-Verbindungstechnik zum Aufbau von Leistungshalbleitermodulen, 1995, ISBN 3-89588
2. Christian Mertens: Die Niedertemperaturverbindungstechnikder Leistungselektronik, 2004, ISBN 3-18-336521-9
3. Jacek Rudzki: Reliability of Ag Sintering vs. Soldering, ECPE Workshop Paris 2009
4. P. Beckedahl, Intelligente Leistungsmodule-Aufbau und Verbindungstechniken für hohe Leistungsdichten und Zuverlässigkeit, Bayern Innovative Kooperationsforum Leistungselektronik, 2011
5. Yvonne Löwer, Sinter Glue-New Horizons in Semiconductor Packaging, EPTC 2011
6. C. Göbl: Low temperature sinter technology Die attachment for power electronic applications, CIPS 2010 Nuremberg