Oxidation-rate excursions during the oxidation of copper in gaseous environments at moderate temperatures

Oxidation of Metals

Volumn 60, Issue 5-6, 2003, Pages 393-408

  Feng, Z ^a   Marks, C R ^b   Barkatt, A ^a  

^a CATHOLIC UNIVERSITY OF AMERICA   (United States)

^b Dominion   (United States)

Author keywords

Copper; Film cracking; Kinetics; Oxidation; Oxide films

Indexed keywords

ACTIVATION ENERGY; CRACKS; GRAIN SIZE AND SHAPE; OXIDATION; REACTION KINETICS; THERMAL EFFECTS; THERMOGRAVIMETRIC ANALYSIS; THICKNESS MEASUREMENT;

FILM CRACKING; LOGARITHMIC RATE LAW; PARABOLIC GROWTH;

COPPER;

EID: 1542335495     PISSN: 0030770X     EISSN: None     Source Type: Journal    
DOI: 10.1023/a:1027331605417     Document Type: Article

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