Study on the effects of copper oxide growth on the peel strength of copper/polyimide

Journal of Electronic Materials

Volumn 37, Issue 8, 2008, Pages 1102-1110

  Lee, H J ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Aging test; Cu PI; Diffusion marker; Humidity test; Kirkendall void; Oxide growth; Peel test

Indexed keywords

(O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; OXIDE GROWTH; PEEL STRENGTH;

COPPER;

COPPER OXIDES;

EID: 46749118749     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0317-z     Document Type: Article

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