Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

Volumn , Issue , 2011, Pages

  Kahler J ^a   Heuck, N ^a   Palm, G ^a   Stranz, A ^a   Waag, A ^a   Peiner, E ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

Electronics packaging; flip chip; nanoparticles; semiconductor device packaging; silver sintering

Indexed keywords

FLIP CHIP; HIGH TEMPERATURE; HYBRID CIRCUIT; LAYER THICKNESS; MICRO-PARTICLES; SEMICONDUCTOR DEVICE PACKAGING; SHEAR TESTS; SILVER PASTES; TEMPERATURE CYCLING; TEMPERATURE LOADS; YOUNG'S MODULUS;

ADHESION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROELECTRONICS; NANOPARTICLES; SINTERING; THERMAL CONDUCTIVITY;

SILVER;

EID: 84857609204     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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