Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy

Microelectronics Reliability

Volumn 53, Issue 9-11, 2013, Pages 1617-1621

  Sabbah, Wissam ^a,b,c   Azzopardi, Stéphane ^a   Buttay, Cyril ^c   Meuret, Régis ^b   Woirgard, Eric ^a  

^a UNIVERSITÉ DE BORDEAUX   (France)

^b SAFRAN AIRCRAFT ENGINES   (France)

^c UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE; HIGH TEMPERATURE POWER ELECTRONICS; HIGH-TEMPERATURE STORAGE; MICROMETER-SCALE; NANO-METER-SCALE; SILVER PARTICLES; SINTERING PROCESS; THERMAL RESISTANCE MEASUREMENT;

ELECTRONICS PACKAGING; GERMANIUM ALLOYS; OPTIMIZATION; POWER ELECTRONICS; SINTERING; SOLDERING; TECHNOLOGY;

SILVER;

EID: 84886884415     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2013.07.101     Document Type: Conference Paper

References (9)

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3. 2) chips IEEE Trans Compon Pack Technol 33 2010 98 104
4. Buttay C et al. Die attach of power devices using silver sintering - bonding process optimisation and characterization. In: Proceedings of the European conference on power electronics (EPE 11); 2011.
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7. X. Li High temperature ratcheting behavior of nanosilver paste sintered lap shear joint under cyclic shear force Microelectron Reliab 53 1 2013 174 181
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9. T. Wang Low-temperature sintering with nanosilver paste in die-attached interconnection J Electron Mate 36 10 2007 1333 1340