Reliability Improvement of high Temperature sintered Ag Die-Attachment by adding Sub-micron SiC Particles

PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of

Volumn , Issue , 2015, Pages

  Zhang, Hao ^a   Nagao, Shijo ^a   Suganuma, Katsuaki ^a   Albrecht, Hans Juergen ^b   Wilke, Klaus ^b  

^a OSAKA UNIVERSITY   (Japan)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION BARRIERS; ENERGY MANAGEMENT; INTELLIGENT ROBOTS; METALLIZING; POWER ELECTRONICS; SILICON CARBIDE; SINTERING; SUBSTRATES;

BONDING STRUCTURE; CROSS-SECTION MORPHOLOGY; DIRECT BONDED COPPERS; HIGH TEMPERATURE STORAGE TEST; INTERFACIAL REGION; RELIABILITY IMPROVEMENT; SURFACE METALLIZATION; ULTRAHIGH TEMPERATURE;

SILVER;

EID: 84997120303     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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