New silver paste for die-attaching ceramic light-emitting diode packages

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 5, 2011, Pages 653-659

  Kuramoto, Masafumi ^a   Ogawa, Satoru ^a   Niwa, Miki ^a,b   Kim, Keun Soo ^c   Suganuma, Katsuaki ^c  

^a NICHIA CORPORATION   (Japan)

^b UNIVERSITY OF TOKUSHIMA   (Japan)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

Ceramics; conducting materials; light emitting diodes; oxygen; silver

Indexed keywords

AG PARTICLES; ALUMINA CERAMIC; BONDING LAYERS; BONDING MATERIALS; BONDING STRENGTH; CERAMIC PACKAGE; CERAMICS; CONDUCTING MATERIALS; DIE-ATTACH MATERIALS; ELECTRONIC COMPONENT; HIGH TEMPERATURE; INGAN LED; LEAD FRAME; LOW-THERMAL-EXPANSION; SILVER PASTES;

CERAMIC MATERIALS; DIES; DIODES; DISPERSIONS; LEAD; LIGHT EMISSION; OXYGEN; SAPPHIRE; SILVER; SINTERED ALUMINA; SINTERING; SOLDERING;

LIGHT EMITTING DIODES;

EID: 84859805503     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2103378     Document Type: Article

References (5)

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3. K. Suganuma, K. S. Kim, and D. S. Kim, "Conductive paste," JP. Patent 2009-170277A, Jul. 2009.
4. M. Kuramoto, S. Ogawa, M. Niwa, K.-S. Kim, and K. Suganuma, "Die bonding for a nitride light-emitting diode by low-temperature sintering of micrometer size silver particles," IEEE Trans. Compon. Packag. Technol., vol. 33, no. 4, pp. 801-808, Dec. 2010.
5. K. E. Polmanteer, "Silicone rubber, its development and technological progress," Rubber Chem. Technol., vol. 61, no. 3, pp. 470-502, 1988.