Bonding of various metals using Ag metallo-organic nanoparticles - A novel bonding process using Ag metallo-organic nanoparticles

Materials Science Forum

Volumn 512, Issue , 2006, Pages 383-388

  Ide, E ^a   Angata, S ^a   Hirose, A ^a   Kobayashi, K F ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Bonding; High melting point solder; Nanoparticles

Indexed keywords

BONDING; MICROSTRUCTURE; ORGANOMETALLICS; PARTICLE SIZE; SHEAR STRENGTH; SILVER ALLOYS;

CROSS-SECTIONAL MICROSTRUCTURES; DISC JOINTS; HIGH MELTING POINT SOLDERS; METALLOORGANIC NANOPARTICLES;

NANOPARTICLES;

EID: 35748961993     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-996-2.383     Document Type: Conference Paper

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