A new generation of power modules with sinter-technology for the automotive industry

1st International Electric Drives Production Conference 2011, EDPC-2011 - Proceedings

Volumn , Issue , 2011, Pages 60-62

  Steger, Jürgen ^a  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BOND WIRE; CERAMIC SUBSTRATES; ELECTRONIC INDUSTRIES; FLEXIBLE CIRCUIT BOARDS; FURTHER DEVELOPMENT; PIN FIN HEAT SINKS; POWER CHIPS; POWER MODULE; RELIABILITY PERFORMANCE; SINTER PROCESS; WEAK POINTS;

ELECTRIC DRIVES; ELECTRIC POWER SYSTEMS; HEAT SINKS; SINTERING; SUBSTRATES;

AUTOMOTIVE INDUSTRY;

EID: 83355163511     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EDPC.2011.6085549     Document Type: Conference Paper

References (6)

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3. German Patent: DE 10 2007 006 706
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6. T.Stockmeier, P. Beckedahl, C.Göbl, T. Malzer: "SKiN: Double side sindering technology for new packages" Proc. ISPSD 2011