Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 408-414

  Xu, Luhua ^a   Pang, John H L ^a   Prakash, Kithva H ^a   Low, T H ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Intermetallic compounds (IMC); Lead free solder; Solder joint; Thermal cycling aging

Indexed keywords

ANNEALING; CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; GRAIN BOUNDARIES; INTERFACES (MATERIALS); LEAD ALLOYS; MATHEMATICAL MODELS; SOLDERING ALLOYS; THERMAL CYCLING;

LEAD-FREE SOLDER; SOLDER JOINT; THERMAL CYCLING AGING;

INTERMETALLICS;

EID: 27644447088     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853593     Document Type: Article

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