Silver micropowders as SiC die attach material for high temperature applications

Proceedings of the International Spring Seminar on Electronics Technology

Volumn , Issue , 2012, Pages 144-148

  Kisiel, Ryszard ^a   Szczepański, Zbigniew ^a   Firek, Piotr ^a   Grochowski, Jakub ^a   Myśliwiec, Marcin ^a   Guziewicz, Marek ^b  

^a WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

DIE-ATTACH MATERIALS; MICRO PARTICLES; MICROPOWDERS; NI/AU METALLIZATION; SIC DEVICES; SURFACE FINISHING; TEST SAMPLES;

ADHESION; EXPERIMENTS; HIGH TEMPERATURE APPLICATIONS; METALLIZING; POWER ELECTRONICS; SILICON CARBIDE; SINTERING; SUBSTRATES;

SILVER;

EID: 84867061560     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2012.6273125     Document Type: Conference Paper

References (4)

1. R. Kisiel, Z. Szczepański "Die-attachment solutions for SiC power devices" Microelectronics Reliability 49 (2009) 627-629.
2. K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K.-S. Kim, M. Nogi: "Low-temperature low-pressure die attach with hybrid silver particle paste" Microelectronics Reliability. (2011), doi:10.1016/j.microrel.2011. 07.088.
3. Kim S.Siow "Mechanical properties of nano-silver joints as die attach materials" J.Alloys Compd. (2011), doi:10.1016/j.aallcom.2011.10. 092.
4. R. Kisiel, Z. Szczepański et al. "Mechanical and thermal properties of SiC-ceramic substrate interface" Proc. Conf. IMAPS-CPMT IEEE, Poland, Gdańsk-Sobieszewo, September 21-24, 2011.