Current problems and possible solutions in high-temperature lead-free soldering

Journal of Materials Engineering and Performance

Volumn 21, Issue 5, 2012, Pages 629-637

  Kroupa, Ales ^a   Andersson, Dag ^b   Hoo, Nick ^c   Pearce, Jeremy ^c   Watson, Andrew ^d   Dinsdale, Alan ^e   Mucklejohn, Stuart ^f  

^a INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

^b SWEREA IVF   (Sweden)

^c ITRI Ltd   (United Kingdom)

^d UNIVERSITY OF LEEDS   (United Kingdom)

^e NATIONAL PHYSICAL LABORATORY   (United Kingdom)

^f Ceravision Limited   (United Kingdom)

Author keywords

Lead free soldering; Materials for high temperature LF solders; New technologies for HT lead free soldering

Indexed keywords

CURRENT DRIVES; CURRENT SITUATION; HIGH TEMPERATURE; INTENSIVE RESEARCH; LEAD-FREE; LEAD-FREE SOLDERING; LOW COSTS; POSSIBLE SOLUTIONS; VIABLE SOLUTIONS;

ELECTRONICS INDUSTRY; MANUFACTURE; SOLDERING ALLOYS;

SOLDERING;

EID: 84862182829     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11665-012-0125-3     Document Type: Review

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