Reliability issues in Pb-free solder joint miniaturization

Journal of Electronic Materials

Volumn 35, Issue 9, 2006, Pages 1761-1772

  Huang, Zhiheng ^a   Conway, Paul P ^a   Jung, Erik ^b   Thomson, Rachel C ^a   Liu, Changqing ^a   Loeher, Thomas ^b   Minkus, Mathias ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Intermetallic compounds; Joint miniaturization; Pb free solders

Indexed keywords

DOCKING; ELECTRODEPOSITION; ELECTRONICS PACKAGING; INTERMETALLICS;

INTERFACIAL INTERACTIONS; JOINT MINIATURIZATION; KINETIC MODELS; SOLDER DIPPING;

SOLDERED JOINTS;

EID: 33749422596     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0231-9     Document Type: Article

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