Precision high temperature lead-free solder interconnections by means of high-energy droplet deposition techniques

CIRP Annals - Manufacturing Technology

Volumn 51, Issue 1, 2002, Pages 177-180

  Conway, P P ^a   Fu, E K Y ^a   Williams, K ^a   Williams, D J ^b  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

^b Bespak Ltd   (United Kingdom)

Author keywords

Lead free soldering; Metal deposition; Welding

Indexed keywords

COMPUTER SIMULATION; DEPOSITION; ELECTRIC ARCS; HIGH TEMPERATURE EFFECTS; LEAD ALLOYS; SURFACE TENSION;

SOLDER INTERCONNECTIONS;

SOLDERED JOINTS;

EID: 0037501297     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)61494-2     Document Type: Review

References (5)

1. Lancaster, J.F., The Physics of Welding. 2 ed. 1986: Pergamon Press.
2. Appelmann, W.W.J., et al., Miniaturisation of droplet deposition. 1995, Philips CFT: Eindhoven.
3. Greene, W.J., An analysis of transfer in gas shielded welding arcs. Transactions of the American Institute of Electrical Engineers (Part 2), 1960. 79: p. 194-203.
4. Waszink, J.H. and L.H. Graat, Experimental investigation of the forces acting on a drop of weld metaL. Welding Journal, 1983. 62(4): p. S108-S116.
5. Nemchinsky, V.A., Size and shape of the liquid droplet at the molten tip of an arc electrode. Journal of Physics D: Applied Physics, 1994. 27: p. 1433-1442.