Shear strength and fracture surface analysis of BiAgNiCuGe/Cu joint

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 30, Issue 10, 2009, Pages 45-48

  Meng, Gongge ^a   Li, Zhengping ^a  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

BiAgNiCuGe; Fracture surface; High temperature lead free solder; Microstructure; Shear strength

Indexed keywords

CRYSTAL BOUNDARY; CU SUBSTRATE; ENERGY DISPERSIVE X-RAY SPECTROMETRY; EUTECTIC PHASE; FRACTURE SURFACE ANALYSIS; FRACTURE SURFACES; HIGH TEMPERATURE; HIGH-TEMPERATURE LEAD-FREE SOLDER; INTERFACE MICROSTRUCTURES; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LIQUID SOLDERS; PRIMARY CRYSTAL; SHEAR FRACTURE; TENSILE TESTING MACHINES;

CRYSTAL MICROSTRUCTURE; FRACTURE; FRACTURE TESTING; GERMANIUM; HYDROGEN EMBRITTLEMENT; INTERMETALLICS; LEAD; MATERIALS TESTING APPARATUS; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILVER; SOLDERING ALLOYS; SUBSTRATES; SURFACE ANALYSIS; SURFACE TESTING; TENSILE TESTING;

TENSILE STRENGTH;

EID: 70749088546     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. 2006.
2. Song J M, Chuang H Y, Wu Z M. Substrate dissolution and shear properties of the joints between Bi-Ag alloys and Cu substrates for high-temperature soldering applications[J]. Journal of Electronic Materials, 2007, 36(11): 1516-1523.
3. Song J M, Chuang H Y, Wu Z M. Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates[J]. Journal of Electronic Materials, 2006, 35(5): 1041-1049.
4. Song J M, Chuang H Y, Wu Z M, et al. Thermal and tensile properties of Bi-Ag alloys[J]. Metallurgical and Materials Transactions A, 2007, 38(6): 1371-1375.
5. Lalena J N, Deng N F, Weiser M W. Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment[J]. Journal of Electronic Materials, 2002, 31(11): 1244-1249.
6. 02818805.5[P]. 2004-12-29.
7. Fang Weiping, Shi Yaowu, Xia Zhidong, et al. Development of high-temperature Pb-free solder for power die attachment[J]. Electronic Components and Materials, 2008, 27(3): 15-18.
8. Divinski S, Herzig C. Radiotracer investigation of diffusion segregation and wetting phenomena in grain boundaries[J]. Journal of Materials Science, 2008, 43(11): 3900-3907.