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Journal of Electronic Materials
Volumn 38, Issue 12, 2009, Pages 2668-2675
Improving the reliability of Si die attachment with Zn-Sn-based high-temperature Pb-free solder using a TiN diffusion barrier
Author keywords

Au 20Sn; Die attachment; Diffusion barrier; High temperature Pb free solder; Interfacial reaction; Joining strength; Pb 5Sn; Thermal cycling; Titanium nitride; Zn Sn
Indexed keywords

AU-20SN; DIE ATTACHMENT; HIGH TEMPERATURE; INTERFACIAL REACTIONS; JOINING STRENGTH; PB FREE SOLDERS; PB-5SN;
EID: 72549097434     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0928-7     Document Type: Article
Times cited : (85)
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