Constraining effects of lead-free solder joints during stress relaxation

Journal of Electronic Materials

Volumn 38, Issue 3, 2009, Pages 392-399

  Zimprich, Peter ^a   Saeed, Usman ^a   Weiss, Brigitte ^a   Ipser, Herbert ^a  

^a UNIVERSITY OF VIENNA   (Austria)

Author keywords

Constraint effect; Creep; Lead free soldering; Sn 3.5Ag; Stress relaxation; Tensile tests

Indexed keywords

CONSTRAINT EFFECT; CREEP MODELS; CU SUBSTRATES; ELECTRONIC DEVICES; GAP SIZES; LEAD-FREE SOLDER JOINTS; LEAD-FREE SOLDERING; MECHANICAL CONSTRAINTS; SN-3.5AG; SOLDER JOINTS; STRESS EXPONENTS; STRESS RELAXATION TESTS; TENSILE MODES; TENSILE TESTS; THERMO-MECHANICAL FATIGUES; THERMO-MECHANICAL PROPERTIES;

ACTIVATION ENERGY; BRAZING; COPPER; CREEP; CUSTOMER SATISFACTION; LEAD; MECHANICAL PROPERTIES; MICROELECTRONICS; QUALITY ASSURANCE; QUALITY FUNCTION DEPLOYMENT; RESIDUAL STRESSES; SILVER; SOLDERING; SOLDERING ALLOYS; STRESS RELAXATION; STRESSES; TENSILE STRENGTH; TENSILE TESTING; TESTING; THERMOMECHANICAL TREATMENT; TOTAL QUALITY MANAGEMENT; WELDING;

TIN;

EID: 59849114612     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0604-3     Document Type: Article

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