Electroless copper deposition with PEG suppression for all-copper flip-chip connections

Journal of the Electrochemical Society

Volumn 156, Issue 7, 2009, Pages

  Osborn, Tyler ^a   Galiba, Nefertari ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTROLLED DEPOSITION; COPPER CHIPS; COPPER PILLARS; ELECTROLESS COPPER; ELECTROLESS COPPER DEPOSITION; ELEVATED TEMPERATURE; FABRICATION TECHNIQUE; FLIP-CHIP CONNECTIONS; HIGH QUALITY; HIGH TEMPERATURE; LOW TEMPERATURE ANNEALING; NITROGEN ENVIRONMENT; PLATING RATES; PROCESS TIME; RESTRICTED REGIONS;

COPPER; COPPER PLATING; ELECTROPLATING; ETHYLENE; ETHYLENE GLYCOL; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; SOLDERING ALLOYS;

COPPER DEPOSITS;

EID: 65949094581     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3123288     Document Type: Article

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