Effect of the content of Cu on solderability and mechanical properties of Bi5Sb solder alloy

Materials Science Forum

Volumn 610-613, Issue , 2009, Pages 537-541

  Yan, Yanfu ^a,b   Feng, Lifang ^a,b   Guo, Xiaoxiao ^a   Tang, Kun ^a   Song, Kexing ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Henan Key Laboratory of Advanced Non ferrous Metals Luoyang   (China)

Author keywords

Bi5Sb solder alloy; Cu; Mechanical properties; Solderability

Indexed keywords

COPPER; COPPER ALLOYS; MECHANICAL PROPERTIES; MELTING POINT; TENSILE STRENGTH; TERNARY ALLOYS;

HIGH TEMPERATURE SOLDERS; NEEDLE-LIKE; SOLDER ALLOYS; SOLDERABILITY;

BISMUTH ALLOYS;

EID: 64349105184     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.610-613.537     Document Type: Conference Paper

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