Ceramic packaging by localized induction heating

Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering

Volumn 7, Issue 4, 2009, Pages 365-369

  Liu, Wen Ming ^a,b   Chen, Ming Xiang ^a,b   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Ceramic package; Induction heating; Local heating; Packaging

Indexed keywords

CERAMIC PACKAGE; CERAMIC PACKAGING; FRACTURE ANALYSIS; HEATING TIME; HIGH FREQUENCY; HIGH-TEMPERATURE DAMAGE; INFRARED THERMAL IMAGER; LOCAL HEATING; LOCAL TEMPERATURE; PACKAGING PROCESS; SIX-AXIS; SOLDER REFLOW; THERMAL-SENSITIVE;

BRAZING; CERAMIC MATERIALS; HELIUM; HERMETIC SEALS; IMAGE SENSORS; INDUCTION HEATING; INFRARED SPECTROSCOPY; LEAD; MASS SPECTROMETRY; STRENGTH OF MATERIALS; TEMPERATURE DISTRIBUTION; TENSILE STRENGTH; WELDING;

HEATING;

EID: 69249232273     PISSN: 16726030     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

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