Properties of intermetallic compound joint made from evaporated Ag/Cu/Sn films

Materials Research Society Symposium Proceedings

Volumn 1129, Issue , 2009, Pages 335-340

  Takahashi, T ^a   Komatsu, S ^a   Kono, T ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CU SUBSTRATE; HIGH TEMPERATURE STRENGTH; HIGH-MELTING; INTERMETALLIC COMPOUNDS; JOINING TECHNIQUES; JOINT RELIABILITY; LEAD FRAME; NANOINDENTATION TESTS; POWER SEMICONDUCTORS; SI CHIPS;

POWER ELECTRONICS; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR GROWTH; SILVER; SOLDERING ALLOYS; TIN;

LEAD;

EID: 70449598002     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment.
2. L. N. Ramanathan, J. W. Jang, J. K. Lin, and D. R. Frear, J. Electron. Mater. 34, 1357 (2005).
3. D. Pan, I. Dutta, S. G. Jadhav, G. F. Raiser, and S. Ma, J. Eleclr. Mater. 34, 1040 (2005).
4. A. Scandurra, A. Porto, and O. Puglisi, Appl. Surf. Sci. 89, 1 (1995).
5. S. Dunford, S. Canumalla and P. Viswanadham, 54th Electronic Components and Technology Conference, Las Vedas, 726 (2004).
6. T. B. Massalski, J. L. Murray, L. H. Bennett and H. Baker, Binary Alloy Phase Diagrams, American Society for Metals, (1986).
7. J. Hey: Mechanical Testing by Indentation. Course Notes, (1997), Nano Instruments, Inc.
8. W. C. Oliver, B and M. Pharr, J. Maler. Res., 7, 1564 (1992).