Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate. Part 1. Thermal properties, microstructure, corrosion and oxidation resistance

Journal of Alloys and Compounds

Volumn 422, Issue 1-2, 2006, Pages 239-243

  Chang, Tao Chih ^a   Wang, Jian Wen ^b   Wang, Moo Chin ^c   Hon, Min Hsiung ^a,d  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b CHUNG HWA UNIVERSITY OF MEDICAL TECHNOLOGY   (Taiwan)

^c NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^d DA YEH UNIVERSITY   (Taiwan)

Author keywords

Corrosion resistance; Heat of fusion; Lead free solder; Oxidation

Indexed keywords

CORROSION RESISTANCE; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; LEAD; MICROSTRUCTURE; OXIDATION; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

HEAT OF FUSION; LEAD FREE SOLDERS; POTENTIOSTAT; WEIGHT GAIN RATIO;

SOLDERING ALLOYS;

EID: 33748086465     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2005.09.094     Document Type: Article

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