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Materials Science and Engineering: A

Volumn 421, Issue 1-2, 2006, Pages 133-142

Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy

(3) Wang, Z X a Dutta, I b Majumdar, B S a

a NEW MEXICO INSTITUTE OF MINING AND TECHNOLOGY (United States)

b Department of Mechanical Engineering Naval Postgraduate School ^* (United States)

Author keywords

Composite; Creep; Electronic packaging; Eshelby; NiTi; Shape memory alloy; Solders

Indexed keywords

CREEP; ELASTICITY; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; NICKEL ALLOYS; SHAPE MEMORY EFFECT; SHEAR STRESS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING;

ESHELBY'S TRANSFORMATION; LEAD-FREE SOLDER; THERMOMECHANICAL FATIGUE;

LEAD ALLOYS;

CREEP; ELASTICITY; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; LEAD ALLOYS; MATHEMATICAL MODELS; NICKEL ALLOYS; SHAPE MEMORY EFFECT; SHEAR STRESS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING;

EID: 33645990269 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2005.10.026 Document Type: Article

Times cited : (12)

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