Development of Au-Ge based candidate alloys as an alternative to high-lead content solders

Journal of Alloys and Compounds

Volumn 490, Issue 1-2, 2010, Pages 170-179

  Chidambaram, Vivek ^a   Hald, John ^a   Hattel, Jesper ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Composite strengthening; High temperature solders; Phase transitions; Phase equilibria; Precipitation; Solid solution strengthening

Indexed keywords

AGING TEMPERATURES; BULK SOLDER; COMPOSITE STRENGTHENING; DISPERSED PHASE; HIGH TEMPERATURE; HIGH TEMPERATURE AGING; HIGH-TEMPERATURE SOLDERS; INTERMETALLIC COMPOUNDS; LATTICE STRAIN; LEAD CONTENT; LOW MELTING POINT; MICROHARDNESS MEASUREMENT; SOLID SOLUTION STRENGTHENING; STRENGTHENING MECHANISMS;

ALLOYING ELEMENTS; ALLOYS; CRYSTALLIZATION; DUCTILITY; EUTECTICS; LEAD; MELTING POINT; METAL REFINING; MICROHARDNESS; MICROSTRUCTURE; PHASE EQUILIBRIA; SEMICONDUCTING INTERMETALLICS; SMELTING; SOLDERING ALLOYS; SOLID SOLUTIONS; SOLIDIFICATION; STRENGTHENING (METAL); THERMAL AGING; TIN; TIN ALLOYS;

GERMANIUM;

EID: 74249101984     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.10.108     Document Type: Article

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