Wetting and soldering behavior of eutectic Au-Ge alloy on Cu and Ni substrates

Journal of Electronic Materials

Volumn 40, Issue 7, 2011, Pages 1533-1541

  Leinenbach, C ^a   Valenza, F ^b   Giuranno, D ^b   Elsener, H R ^a   Jin, S ^a   Novakovic, R ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b CNR   (Italy)

Author keywords

High temperature solder; Lead free solder; Soldering; Wetting

Indexed keywords

CONTROLLED CONDITIONS; CU SUBSTRATE; HIGH TEMPERATURE; LEAD FREE SOLDERS; LEAD-FREE SOLDER; LOW MELTING POINT; NI SUBSTRATES; SOLDER JOINTS; THERMAL AND ELECTRICAL CONDUCTIVITY;

CONTACT ANGLE; COPPER ALLOYS; CORROSION RESISTANCE; DISSOLUTION; ELECTRIC CONDUCTIVITY; EUTECTICS; FILLERS; GERMANIUM; GOLD; INTERMETALLICS; METAL FOIL; NICKEL COMPOUNDS; SHEAR STRENGTH; SOLDERING ALLOYS; SUBSTRATES; WETTING;

SOLDERING;

EID: 80051582564     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1639-4     Document Type: Article

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