A study of the shear response of a lead-free composite solder by experimental and homogenization techniques

Journal of Electronic Materials

Volumn 38, Issue 10, 2009, Pages 2122-2131

  Sivasubramaniam, V ^a,b   Galli, M ^c   Cugnoni, J ^b   Janczak Rusch, J ^a   Botsis, J ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b EPFL   (Switzerland)

^c UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Composite; Homogenization; Lead free; Mechanical properties; Shear test

Indexed keywords

COMPOSITE; COMPOSITE SOLDERS; ELASTOPLASTIC RESPONSE; EXPERIMENTAL DATA; FINITE ELEMENT; HOMOGENIZATION; HOMOGENIZATION TECHNIQUES; LEAD FREE SOLDERS; LEAD-FREE; LOAD SHARING; LOAD-DISPLACEMENT RESPONSE; MATRIX; MATRIX MATERIALS; MECHANICAL RESPONSE; MODELING APPROACH; OPTIMIZED GEOMETRIES; PARTICLE VOLUME FRACTIONS; PLASTIC STRAIN LOCALIZATION; SHEAR RESPONSE; SHEAR TEST; SINGLE LAP SHEARS; SOLDER MATERIAL; THREE-DIMENSIONAL (3D); TRI-AXIAL STRESS STATE; ULTIMATE STRAIN; ULTIMATE STRENGTH; ULTIMATE STRESS;

BRAZING; HOMOGENIZATION METHOD; MECHANICAL PROPERTIES; REINFORCEMENT; SOLDERING ALLOYS; THREE DIMENSIONAL; TITRATION; WELDING;

LEAD;

EID: 69049102992     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0878-0     Document Type: Article

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