A review of Pb-free high-temperature solders for power-semiconductor devices: Bi-base composite solder and Zn-Al base solder

Journal of ASTM International

Volumn 8, Issue 1, 2011, Pages

  Takaku, Y ^a   Ohnuma, I ^a   Yamada, Y ^b   Yagi, Y ^b   Nakagawa, I ^c   Atsumi, T ^c   Shirai, M ^c   Ishida, K ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b Rd Management Section   (Japan)

^c TOYOTA MOTOR CORPORATION   (Japan)

Author keywords

High temperature solder; Intermetallic compound IMC; Thermal cycle test

Indexed keywords

BASE ALLOYS; COMPOSITE SOLDERS; CU-AL-MN ALLOY; EUTECTIC ALLOYS; HIGH RELIABILITY; HIGH STABILITY; HIGH TEMPERATURE; INTERMETALLIC COMPOUND IMC; MATRIX; PB-FREE; PROPAGATION OF CRACKS; REINFORCEMENT PARTICLES; SUPERELASTIC; THERMAL CYCLE TESTS;

ALUMINUM; INTERMETALLICS; LEAD; MANGANESE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SOLDERING ALLOYS; THERMAL CYCLING; TIN ALLOYS; ZINC; ZINC ALLOYS;

TIN;

EID: 78751651358     PISSN: None     EISSN: 1546962X     Source Type: Journal    
DOI: 10.1520/JAI103042     Document Type: Article

References (25)

1. Ueda, H., Sugimoto, M., Uesugi, T., Fujisima, O., and Kachi, T., "High Current Operation of GaN Power HEMTS," Proc. of the 17th Inter. Symp. Power Semicond. Devices & IC's, Santa Barbara, CA, May 23-26, IEEE, 2005, pp. 311-314.
2. Asano, K., Hayashi, T., Takahashi, D., Sugawara, Y., Ryu, S.-H., and Palmour, J. W., "Temperature Dependence of On-State Characteristics, and Switching Characteristics of 5kV class 4H-SiC SE-JFET," IEEJ Trans. IA, Vol. 125, 2005, pp. 147-152.
3. Pietranico, S., Pommier, S., Lefebvre, S., Khatir, Z., and Bontemps, S., "Characterization of Power Modules Ceramic Substrates for Reliability Aspects," Microelectron. Reliab., Vol. 49, 2009, pp. 1260-1266.
4. Karakaya, I. and Thompson, W. T., Bull. Alloy Phase Diagrams, Vol. 8, 1987, pp. 340-347.
5. Saunders, N. and Miodownik, A. P., Phase Diagrams of Binary Copper Alloys, P. R. Subramanian, D. J. Charkrabarti, and D. E. Laughlin, Eds., ASM International, Materials Park, OH, 1994, pp. 412-418.
6. Suganama, K., Kim, S.-J., and Kim, K.-S., "High-Temperature Lead-Free Solders: Properties and Possibilities," JOM, Vol. 61, 2009, pp. 65-71.
7. Kim, S., Kim, K.-S., Suganuma, K., and Izuta, G., "Interfacial Reaction of Si Die Attachment with Zn-Sn and Au-20Sn High temperature Lead-Free Solders on Cu Substrate," J. Electron. Mater., Vol. 38, 2009, pp. 873-883.
8. Takahashi, T., Komatsu, S., Nishikawa, H., and Takemoto, T., "Improvement of High-Temperature Performance of Zn-Sn Solder Joint," J. Electron. Mater., Vol. 39, 2010, pp. 1241-1247.
9. Jiang, J., Lee, J.-E., Kim, K.-S., and Suganuma, K., "Oxidation Behavior of Sn-Zn Solders Under High-Temperature and High-Humidity Conditions," J. Alloys Compd., Vol. 462, 2008, pp. 244-251.
10. Okamoto, H. and Massalski, T. B., Phase Diagrams of Binary Gold Alloys, H. Okamoto and T. B. Massalski, Eds., ASM International, Materials Park, OH, 1987, pp. 278-289.
11. Okamoto, H. and Massalski, T. B., "The Au-Si (Gold-Silicon) System," Bull. Alloy Phase Diagrams, Vol. 4[2], 1983, pp. 190-198.
12. Liu, X. J., Ohnuma, I., Wang, C. P., Jiang, M., Kainuma, R., Ishida, K., Ode, M., Koyama, T., Onodera, H., and Suzuki, T., "Thermodynamic Database on Microsolders and Copper-Based Alloy Systems," J. Electron. Mater., Vol. 32, 2003, pp. 1265-1272.
13. Liu, X. J., Kinaka, M., Takaku, Y., Ohnuma, I., Kainuma, R., and Ishida, K., "Experimental Inves-tigation and Thermodynamic Calculation of Phase Equilibria in the Sn-Au-Ni System," J. Electron. Mater., Vol. 34, 2005, pp. 670-679.
14. Takaku, Y., Ohnuma, I., Yamada, Y., Yagi, Y., Nishibe, Y., Kainuma, R., and Ishida, K., "Develop-ment of Bi-Base High-Temperature Pb-Free Solders with Second Phase Dispersion: Thermodynamic Calculation, Microstructure and Interfacial Reaction," J. Electron. Mater., Vol. 35, 2006, pp. 1926-1932.
15. Shimizu, T., Ishikawa, H., Ohnuma, I., and Ishida, K., "Zn-Al-Mg-Ga Alloys as Pb-Free Solder for Die-Attaching Use," J. Electron. Mater., Vol. 28, 1999, pp. 1172-1175.
16. Rettenmayr, M., Lambracht, P., Kempf, B., and Tschudin, C., "Zn-Al Based Alloys as Pb-Free Solders for Die Attach," J. Electron. Mater., Vol. 31, 2002, pp. 278-285.
17. Yamada, Y., Takaku, Y., Yagi, Y., Nishibe, Y., Ohnuma, I., Sutou, Y., Kainuma, R., and Ishida, K., "Pb-Free High Temperature Solders for Power Device Packaging," Microelectron. Reliab., Vol. 46, 2006, pp. 1932-1937.
18. Dybkov V. I. and Duchenko, O. V. " Growth Kinetics of Compound Layers at the Nickel-Bismuth Interface," J. Alloys Compd., Vol. 234. 1996. 295-300.
19. Lin, C.-Y., Jao, C.-C., Lee, C., and Yen, Y.-W., "The Effect of Non-Reactive Alloying Elements on the Growth Kinetics of the Intermetallic Compound Between Liquid Sn-Based Eutectic Solders and Ni Substrates," J. Alloys Compd., Vol. 440, 2007, pp. 333-340.
20. Chan, Y. C., Chiu, M. Y., and Chuang, T. H., "Intermetallic Compounds Formed During the Solder-ing Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates," Z. Metallkd., Vol. 93, 2002, pp. 95-98.
21. Takaku, Y., Liu, X. J., Ohnuma, I., Kainuma, R., and Ishida, K., "Interfacial Reaction and Morphol-ogy Between Molten Sn Base Solders and Cu Substrate," Mater. Trans., Vol. 45, 2004, pp. 646-651.
22. Takaku, Y., Felicia, L., Ohnuma, I., Kainuma, R., and Ishida, K., "Interfacial Reaction Between Cu Substrate and Zn-Al Based High Temperature Pb-Free Solders," J. Electron. Mater., Vol. 37, 2008, pp. 314-323.
23. Takaku, Y., Makino, K., Watanabe, K., Ohnuma, I., Kainuma, R., Yamada, Y., Yagi, Y., Nakagawa, I., Atsumi, T., and Ishida, K., "Interfacial Reaction Between Zn-Al-Based High-Temperature Solders and Ni Substrate," J. Electron. Mater., Vol. 38, 2009, pp. 54-60.
24. Ellner, M., Kattner, V., and Predel, B., "Konstitutionelle und Strukturelle Untersuchungen im Alu-miniumreichen Teil der Systeme Ni-Al und Pt-Al (Constitutional and Structural Investigation of Al-Rich Portion in the Ni-Al and Pt-Al Systems)," J. Less-Common Met., Vol. 87, 1982, pp. 305-325.
25. 3 Phases in the Al-Cu-Ni System by Mechanical Alloying," Philos. Mag. Lett., Vol. 87, 2007, pp. 781-789.