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Volumn 40, Issue 10, 2011, Pages 2081-2092

On the mutual effect of viscoplasticity and interfacial damage progression in interfacial fracture of lead-free solder joints

(3) Maleki, Milad a Cugnoni, Joel a Botsis, John a

a EPFL (Switzerland)

Author keywords

Anand constitutive model; cohesive zone modeling; interfacial failure; Lead free solder; viscoplastic deformation

Indexed keywords

ANAND MODEL; BULK SOLDER; COHESIVE ZONES; COHESIVE-ZONE MODELING; CONSTITUTIVE PARAMETERS; CREEP RELAXATION; DAMAGE MODEL; DOUBLE CANTILEVER BEAM; EFFECT OF STRAIN; EXTERNAL ENERGY; FINITE-ELEMENT MODELS; FRACTURE TEST; INTERFACIAL DAMAGES; INTERFACIAL FAILURES; INTERFACIAL FRACTURE; LEAD FREE SOLDERS; LEAD-FREE SOLDER JOINT; LOAD CAPABILITY; MODE I FRACTURE; NORMAL STRESS; THREE-DIMENSIONAL (3D); VISCOPLASTIC; VISCOPLASTIC DEFORMATION; VISCOPLASTIC RESPONSE;

CANTILEVER BEAMS; DEFORMATION; FINITE ELEMENT METHOD; FRACTURE; FRACTURE TESTING; THREE DIMENSIONAL;

STRAIN RATE;

EID: 80052968517 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1718-6 Document Type: Article

Times cited : (12)

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