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Journal of Materials Science

Volumn 45, Issue 8, 2010, Pages 2051-2056

Experimental study of density, surface tension, and contact angle of Sn-Sb-based alloys for high temperature soldering

(5) Plevachuk, Yu a Hoyer, W b Kaban, I b Kohler M c Novakovic, R d

a IVAN FRANKO NATIONAL UNIVERSITY OF LVIV (Ukraine)

b CHEMNITZ UNIVERSITY OF TECHNOLOGY (Germany)

c GERMAN AEROSPACE CENTER DLR (Germany)

d CNR (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

EXPERIMENTAL DATA; EXPERIMENTAL STUDIES; HIGH TEMPERATURE; LIQUID ALLOY; NI SUBSTRATES; SESSILE DROPS; TEMPERATURE RANGE; THERMODYNAMIC MODEL; WETTING BEHAVIOR;

BINARY ALLOYS; CAPILLARITY; CONTACT ANGLE; COPPER ALLOYS; SOLDERING ALLOYS; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE TENSION; TIN; WETTING;

TIN ALLOYS;

EID: 77949875074 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-009-4120-5 Document Type: Article

Times cited : (58)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.