Joining characteristics of various high temperature lead-free interconnection materials

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1764-1768

  Suganuma, K ^a   Kim, K S ^a   Kim, S S ^a   Kim, D S ^a   Kang, M ^a   Kim, S J ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; DEGRADATION MECHANISM; HIGH TEMPERATURE; HUMID CONDITIONS; INTERFACE STABILITIES; INTERFACIAL DEGRADATION; LEAD FREE SOLDERS; LEAD-FREE; OXIDE LAYER; ROOT CAUSE; SN ALLOYS; SN PLATING; STANDARD METHOD; TEM ANALYSIS; THERMAL CYCLING TEST; THIN LAYERS;

DEGRADATION; IMPACT TESTING; LEAD; PHASE INTERFACES; SOLDERING ALLOYS; TIN ALLOYS; ZINC;

TIN;

EID: 70349680388     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074255     Document Type: Conference Paper

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