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Volumn , Issue , 2008, Pages

Addressing industry knowledge gaps regarding new Pb-free solder alloy alternatives

Author keywords

[No Author keywords available]

Indexed keywords

AG-ALLOY; COPPER DISSOLUTION; INDUSTRY STANDARDS; KNOWLEDGE GAPS; MECHANICAL BEHAVIOR; NEW ALLOYS; PB-FREE ALLOYS; PB-FREE PROCESS; PB-FREE SOLDER ALLOYS; PRINTED CIRCUIT ASSEMBLIES; SN-AG-CU; SN-AG-CU ALLOY; SOLDER JOINTS; SOLDER PASTE; SUPPLY CHAIN COMPLEXITY;

EID: 77955117137     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507794     Document Type: Conference Paper
Times cited : (11)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.